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For your free copy of our Right Fit for Challenging Sensor Packaging CD-ROM (containing additional information about Ticona, our performance engineering polymers for sensor packaging and specific application stories) please fill out the
request form.
The Right Fit for Challenging Sensor Packaging
As the leader in engineering polymers for consumer electronics, Ticona knows E/E components. Ticona's high-performance polymers for advanced sensor packaging are engineered to outperform other materials, offering excellent chemical and hydrolysis resistance, superior thermal resistance and high dimensional stability to help improve sensor reliability and performance in the harshest environments. Ticona's engineering polymers for robust sensor packaging applications include:
Celanex®
PBT |
Good mechanicals, chemical resistance and electrical properties, low moisture absorption; hydrolysis resistant grades, high-flow-easy-to-fill grades, flame retardant grades. Good adhesion to silicones and potting compounds, laser markable and paintable. |
Fortron® PPS |
Operating temperatures as measured per UL Relative Thermal
Index up to 220°C, withstands surface mount soldering, inherent flame resistance,
low creep, low CLTE, low moisture absorption, excellent chemical resistance and dimensional capability, laser markable. |
Vectra® LCP |
Short-term temperature exposure up to 340°C for surface-mount
and lead-free soldering, operating temperatures as measured per UL Relative Thermal Index up to 240°C,
thin walls (down to 0.006"), extremely low shrinkage, no flash, low CLTE, inherent flame resistance, low moisture absorption, excellent chemical resistance,
ESD and conductive grades, laser markable, RoHS & WEEE compliant. |
For more information on Ticona's advanced solutions for sensor packaging, contact the expert:
Fran Marchand
frances.marchand@ticona.com
Visit Ticona Booth #310 at the Sensors Expo & Conference
Donald E. Stephens Convention Center - Rosemont, Illinois
June 9-11, 2008
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